Automotive Power MOSFETs

Datum: 15.12.2011 | Views: 1051566 | Länge: 6:01
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Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS™ T2 power MOSFETs offer best-in- class specifications. Infineon uses a diffusion soldering die attach approach to produce dedicated products in TO263, TO220 and TO262. Four OptiMOS™ T2 products in these packages are ready for production: the IPB160N04S4-02D (with 160A in a TO263 package), the IPB100N04S4-02D (with 100A in TO263) and the IPP/I100N04S4-03D (with 100A in TO220 and TO262). With those products, Infineon exceeds current RoHS (Restriction on Hazardous Substances) directives related to lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives pending implementation after 2014 may require 100% lead-free packaging. The new Infineon devices allow customers to meet these stricter requirements.


Makers Box - Teaser
Länge: 1:04
Datum: 20.07.2018 | Views: 254

Makers Box - Teaser

Meet us @DAHO.AM18 - The Pure Tech Conference. For more information goto: www.infineon.com/makers.  
Meet us @DAHO.AM18 - The Pure Tech Conference. For more information goto: www.infineon.com/makers.  
Infineon Image Film
Länge: 1:12
Datum: 29.01.2018 | Views: 119

Infineon Image Film

Coil on Module – Packaging innovation for eID documents
Länge: 3:11
Datum: 12.12.2017 | Views: 100

Coil on Module – Packaging innovation for eID documents

Learn about the innovative dual- interface chip packaging technology from Infineon, designed to increase the durability and robustness of smart cards. While at the same time reducing cost for the manufacturer .
Learn about the innovative dual- interface chip packaging technology from Infineon, designed to increase the durability and robustness of smart cards. While at the same time reducing cost for the manufacturer .
Infineon's way to contextual awareness – Ep. 1 the differentiation between speaker and loudspeaker
Länge: 3:26
Datum: 21.11.2017 | Views: 241

Infineon's way to contextual awareness – Ep. 1 the differentiation between speaker and loudspeaker

Infineon’s first step towards contextual awareness – using sensor fusion to make the interaction with smart devices more meaningful.

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Infineon’s first step towards contextual awareness – using sensor fusion to make the interaction with smart devices more meaningful.

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600 V CoolMOS™ CFD7 SJ MOSFET – Infineon’s answer to resonant topologies
Länge: 4:55
Datum: 08.11.2017 | Views: 289

600 V CoolMOS™ CFD7 SJ MOSFET – Infineon’s answer to resonant topologies

CoolMOS™ CFD7 is Infineon’s latest high voltage SJ MOSFET technology with an integrated fast body diode. It is the ideal choice for resonant high power applications.

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CoolMOS™ CFD7 is Infineon’s latest high voltage SJ MOSFET technology with an integrated fast body diode. It is the ideal choice for resonant high power applications.

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