TRENCHSTOP™ Advanced Isolation Packaging Technology

Datum: 05.05.2017 | Views: 41 | Länge: 3:10
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This video explains the market motivation for a new type of isolated package for power semiconductors. It also shows the benefits of new TRENCHSTOP™ advanced isolation technology for customers using IGBTs.
Erneuerbare Energien aus Offshore Windparks und Windkraftanlagen
Länge: 7:32
Datum: 20.01.2012 | Views: 6449

Erneuerbare Energien aus Offshore Windparks und Windkraftanlagen

Die spezielle Technologie des Münchner Halbleiterunternehmens Infineon ermöglicht mit so genannten Hochleistungsschaltern den Bau eines Stromnetzes, über das die umweltfreundliche Energie von Offshore Windparks und Windkraftanlagen nahezu verlustfrei an Land fließen kann. Darüber hinaus kann die erneuerbare Energie der Offshore Windkraftanlagen mit Hilfe dieser Technologie auch nach Norwegen transportiert werden und dort in Wasserspeicherkraftwerken lagern.
Die spezielle Technologie des Münchner Halbleiterunternehmens Infineon ermöglicht mit so genannten Hochleistungsschaltern den Bau eines Stromnetzes, über das die umweltfreundliche Energie von Offshore Windparks und Windkraftanlagen nahezu verlustfrei an Land fließen kann. Darüber hinaus kann die erneuerbare Energie der Offshore Windkraftanlagen mit Hilfe dieser Technologie auch nach Norwegen transportiert werden und dort in Wasserspeicherkraftwerken lagern.
TriCore™ Free Tool Chain Tutorial
Länge: 0:52
Datum: 11.01.2012 | Views: 159545

TriCore™ Free Tool Chain Tutorial

The gain in performance and feature set of modern microcontrollers lead to inevitable increase of complexity. To cope with this Infineon offers free and a complete tool chain that help customers in their development from initialization with an intuitive graphical user interface to extensive on chip debugging.
The gain in performance and feature set of modern microcontrollers lead to inevitable increase of complexity. To cope with this Infineon offers free and a complete tool chain that help customers in their development from initialization with an intuitive graphical user interface to extensive on chip debugging.
Motor Control with Hybrid Kit for HybridPACK™1 Pin-Fin
Länge: 8:21
Datum: 11.01.2012 | Views: 177296

Motor Control with Hybrid Kit for HybridPACK™1 Pin-Fin

With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.

Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.

Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
ISOFACE
Länge: 2:56
Datum: 11.01.2012 | Views: 42658

ISOFACE

The ISO1H8xxG product family offers robust and intelligent galvanic isolation between the μC, respectively μP, also referred to as the "control side", and the 24V factory floor environment, commonly referred to as "process side".
The ISO1H8xxG are fully protected 8-channel high-side power switches, able to handle currents up to 1.2A per channel. When combining two outputs, one can even switch 2A loads.
Offering parallel and serial μC interfaces, the ISO1H8xxG family can directly be connected with virtually any μC, μP or Bus-ASIC.
The ISO1H8xxG product family offers robust and intelligent galvanic isolation between the μC, respectively μP, also referred to as the "control side", and the 24V factory floor environment, commonly referred to as "process side".
The ISO1H8xxG are fully protected 8-channel high-side power switches, able to handle currents up to 1.2A per channel. When combining two outputs, one can even switch 2A loads.
Offering parallel and serial μC interfaces, the ISO1H8xxG family can directly be connected with virtually any μC, μP or Bus-ASIC.
Automotive Power MOSFETs
Länge: 6:01
Datum: 15.12.2011 | Views: 1051557

Automotive Power MOSFETs

Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS™ T2 power MOSFETs offer best-in- class specifications. Infineon uses a diffusion soldering die attach approach to produce dedicated products in TO263, TO220 and TO262. Four OptiMOS™ T2 products in these packages are ready for production: the IPB160N04S4-02D (with 160A in a TO263 package), the IPB100N04S4-02D (with 100A in TO263) and the IPP/I100N04S4-03D (with 100A in TO220 and TO262). With those products, Infineon exceeds current RoHS (Restriction on Hazardous Substances) directives related to lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives pending implementation after 2014 may require 100% lead-free packaging. The new Infineon devices allow customers to meet these stricter requirements.


Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS™ T2 power MOSFETs offer best-in- class specifications. Infineon uses a diffusion soldering die attach approach to produce dedicated products in TO263, TO220 and TO262. Four OptiMOS™ T2 products in these packages are ready for production: the IPB160N04S4-02D (with 160A in a TO263 package), the IPB100N04S4-02D (with 100A in TO263) and the IPP/I100N04S4-03D (with 100A in TO220 and TO262). With those products, Infineon exceeds current RoHS (Restriction on Hazardous Substances) directives related to lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives pending implementation after 2014 may require 100% lead-free packaging. The new Infineon devices allow customers to meet these stricter requirements.