Infineon EconoPACK™ + D-Series

Datum: 13.10.2011 | Views: 2500 | Länge: 4:58
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The new device features an improved softness during switch-off and as a result of the soft turn-off a reduced EMI effort.

A lower overshoot voltage as the result of a reduced turn-off current slope, di/dt, in combination with a 50V higher blocking capability, VCES=650V, provides a significant advantage for the application.

The high short circuit capability, tp=10μs, comes as a real surplus for a robust design.
XHP™ -  Infineon´s new flexible high power platform
Länge: 4:36
Datum: 22.10.2015 | Views: 6671

XHP™ - Infineon´s new flexible high power platform

www.infineon.com/xhp

Get an first impression how XHP™ will boost your system. This video explain how you can reach the next level of flexibility with Infineon´s new high power platform.
www.infineon.com/xhp

Get an first impression how XHP™ will boost your system. This video explain how you can reach the next level of flexibility with Infineon´s new high power platform.
EiceDRIVER™ 2EDL Driver IC Family
Länge: 9:21
Datum: 11.04.2014 | Views: 376753

EiceDRIVER™ 2EDL Driver IC Family

EiceDRIVER™ 2EDL is a 600V half bridge gate driver IC family basing on level-shifter SOI (Silicon on Insulator) technology, which integrates low-ohmic ultrafast bootstrap diode and supports higher efficiency and smaller form factors of applications. 
EiceDRIVER™ 2EDL is a 600V half bridge gate driver IC family basing on level-shifter SOI (Silicon on Insulator) technology, which integrates low-ohmic ultrafast bootstrap diode and supports higher efficiency and smaller form factors of applications. 
PressFIT Technology
Länge: 3:00
Datum: 22.02.2012 | Views: 97674

PressFIT Technology

Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.
Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.
Motor Control with Hybrid Kit for HybridPACK™1 Pin-Fin
Länge: 8:21
Datum: 11.01.2012 | Views: 177272

Motor Control with Hybrid Kit for HybridPACK™1 Pin-Fin

With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.

Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.

Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
Infineon’s New 4.5kV IHV IGBT
Länge: 4:19
Datum: 13.10.2011 | Views: 14282

Infineon’s New 4.5kV IHV IGBT

The new 4.5kV IGBT modules are optimized for use in traction drives and high-voltage DC transmission systems.

Thanks to the elevated current density of these devices which incorporate the latest IGBT3/EC3 chips, more power can be transmitted and higher output can be achieved without altering the existing inverter design or needing a more powerful cooling.
The new 4.5kV IGBT modules are optimized for use in traction drives and high-voltage DC transmission systems.

Thanks to the elevated current density of these devices which incorporate the latest IGBT3/EC3 chips, more power can be transmitted and higher output can be achieved without altering the existing inverter design or needing a more powerful cooling.