XHP™ - Infineon´s new flexible high power platform

Datum: 22.10.2015 | Views: 6683 | Länge: 4:36
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www.infineon.com/xhp

Get an first impression how XHP™ will boost your system. This video explain how you can reach the next level of flexibility with Infineon´s new high power platform.
EiceDRIVER™ 2EDL Driver IC Family
Länge: 9:21
Datum: 11.04.2014 | Views: 379691

EiceDRIVER™ 2EDL Driver IC Family

EiceDRIVER™ 2EDL is a 600V half bridge gate driver IC family basing on level-shifter SOI (Silicon on Insulator) technology, which integrates low-ohmic ultrafast bootstrap diode and supports higher efficiency and smaller form factors of applications. 
EiceDRIVER™ 2EDL is a 600V half bridge gate driver IC family basing on level-shifter SOI (Silicon on Insulator) technology, which integrates low-ohmic ultrafast bootstrap diode and supports higher efficiency and smaller form factors of applications. 
PressFIT Technology
Länge: 3:00
Datum: 22.02.2012 | Views: 97682

PressFIT Technology

Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.
Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.
Motor Control with Hybrid Kit for HybridPACK™1 Pin-Fin
Länge: 8:21
Datum: 11.01.2012 | Views: 177310

Motor Control with Hybrid Kit for HybridPACK™1 Pin-Fin

With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.

Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.

Variations in the requirements for mild and full hybrid applications have been taken into account for each design.