Datum: 11.01.2012
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Views: 177310
With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.
Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.
Variations in the requirements for mild and full hybrid applications have been taken into account for each design.