SPIDER+ LED cost efficient LED driver solution with diagnosis & protection

Datum: 26.07.2017 | Views: 286 | Länge: 4:33
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Looking for a smart cost effective LED driver?
Infineon supports LED light designs with a cost effective driver solution equipped with diagnosis and protection functions.

In this video the concept of a SPIDER+LED (product: TLE75602-EMH) based driver solution is demonstrated with focus on the diagnosis and protection functions.

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Automotive Power MOSFETs
Länge: 6:01
Datum: 15.12.2011 | Views: 1051557

Automotive Power MOSFETs

Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS™ T2 power MOSFETs offer best-in- class specifications. Infineon uses a diffusion soldering die attach approach to produce dedicated products in TO263, TO220 and TO262. Four OptiMOS™ T2 products in these packages are ready for production: the IPB160N04S4-02D (with 160A in a TO263 package), the IPB100N04S4-02D (with 100A in TO263) and the IPP/I100N04S4-03D (with 100A in TO220 and TO262). With those products, Infineon exceeds current RoHS (Restriction on Hazardous Substances) directives related to lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives pending implementation after 2014 may require 100% lead-free packaging. The new Infineon devices allow customers to meet these stricter requirements.


Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS™ T2 power MOSFETs offer best-in- class specifications. Infineon uses a diffusion soldering die attach approach to produce dedicated products in TO263, TO220 and TO262. Four OptiMOS™ T2 products in these packages are ready for production: the IPB160N04S4-02D (with 160A in a TO263 package), the IPB100N04S4-02D (with 100A in TO263) and the IPP/I100N04S4-03D (with 100A in TO220 and TO262). With those products, Infineon exceeds current RoHS (Restriction on Hazardous Substances) directives related to lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives pending implementation after 2014 may require 100% lead-free packaging. The new Infineon devices allow customers to meet these stricter requirements.