SPIDER+ LED cost efficient LED driver solution with diagnosis & protection

Datum: 26.07.2017 | Views: 92 | Länge: 4:33
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Looking for a smart cost effective LED driver?
Infineon supports LED light designs with a cost effective driver solution equipped with diagnosis and protection functions.

In this video the concept of a SPIDER+LED (product: TLE75602-EMH) based driver solution is demonstrated with focus on the diagnosis and protection functions.

More information



Automotive LED drivers
Länge: 3:36
Datum: 08.02.2012 | Views: 201569

Automotive LED drivers

Infineon`s Basic LED driver for low to medium power LEDs enable high flexibility, LED diagnostic, PWM operation and protection functions. 
LIN LED enables individual car interior design by Smart Color and Light Management as it allows the driver to adjust the interior`s color and light setting individually. The LIN LED driver is a smart three channel current source with integrated constant current source output stages, LIN-transceiver for communication, internal supply, logic and non volatile memory.
Infineon`s Basic LED driver for low to medium power LEDs enable high flexibility, LED diagnostic, PWM operation and protection functions. 
LIN LED enables individual car interior design by Smart Color and Light Management as it allows the driver to adjust the interior`s color and light setting individually. The LIN LED driver is a smart three channel current source with integrated constant current source output stages, LIN-transceiver for communication, internal supply, logic and non volatile memory.
TriCore™ Free Tool Chain Tutorial
Länge: 0:52
Datum: 11.01.2012 | Views: 159531

TriCore™ Free Tool Chain Tutorial

The gain in performance and feature set of modern microcontrollers lead to inevitable increase of complexity. To cope with this Infineon offers free and a complete tool chain that help customers in their development from initialization with an intuitive graphical user interface to extensive on chip debugging.
The gain in performance and feature set of modern microcontrollers lead to inevitable increase of complexity. To cope with this Infineon offers free and a complete tool chain that help customers in their development from initialization with an intuitive graphical user interface to extensive on chip debugging.
Motor Control with Hybrid Kit for HybridPACK™1 Pin-Fin
Länge: 8:21
Datum: 11.01.2012 | Views: 177273

Motor Control with Hybrid Kit for HybridPACK™1 Pin-Fin

With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.

Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.

Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
Automotive Power MOSFETs
Länge: 6:01
Datum: 15.12.2011 | Views: 1051064

Automotive Power MOSFETs

Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS™ T2 power MOSFETs offer best-in- class specifications. Infineon uses a diffusion soldering die attach approach to produce dedicated products in TO263, TO220 and TO262. Four OptiMOS™ T2 products in these packages are ready for production: the IPB160N04S4-02D (with 160A in a TO263 package), the IPB100N04S4-02D (with 100A in TO263) and the IPP/I100N04S4-03D (with 100A in TO220 and TO262). With those products, Infineon exceeds current RoHS (Restriction on Hazardous Substances) directives related to lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives pending implementation after 2014 may require 100% lead-free packaging. The new Infineon devices allow customers to meet these stricter requirements.


Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS™ T2 power MOSFETs offer best-in- class specifications. Infineon uses a diffusion soldering die attach approach to produce dedicated products in TO263, TO220 and TO262. Four OptiMOS™ T2 products in these packages are ready for production: the IPB160N04S4-02D (with 160A in a TO263 package), the IPB100N04S4-02D (with 100A in TO263) and the IPP/I100N04S4-03D (with 100A in TO220 and TO262). With those products, Infineon exceeds current RoHS (Restriction on Hazardous Substances) directives related to lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives pending implementation after 2014 may require 100% lead-free packaging. The new Infineon devices allow customers to meet these stricter requirements.