Infineon's REAL3™ image sensor - time of flight (ToF)

Datum: 05.04.2017 | Views: 1 | Länge: 2:24
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Introduction to Infineon's REAL3™ image sensor - time of flight (ToF)

Demonstration at Mobile World Congress 2017 in Barcelona
TriCore™ Free Tool Chain Tutorial
Länge: 0:52
Datum: 11.01.2012 | Views: 159529

TriCore™ Free Tool Chain Tutorial

The gain in performance and feature set of modern microcontrollers lead to inevitable increase of complexity. To cope with this Infineon offers free and a complete tool chain that help customers in their development from initialization with an intuitive graphical user interface to extensive on chip debugging.
The gain in performance and feature set of modern microcontrollers lead to inevitable increase of complexity. To cope with this Infineon offers free and a complete tool chain that help customers in their development from initialization with an intuitive graphical user interface to extensive on chip debugging.
Motor Control with Hybrid Kit for HybridPACK™1 Pin-Fin
Länge: 8:21
Datum: 11.01.2012 | Views: 177264

Motor Control with Hybrid Kit for HybridPACK™1 Pin-Fin

With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.

Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
With the introduction of the HybridPACK™ and EiceDRIVER™ family, Infineon® has developed new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications.

Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
Automotive Power MOSFETs
Länge: 6:01
Datum: 15.12.2011 | Views: 1050771

Automotive Power MOSFETs

Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS™ T2 power MOSFETs offer best-in- class specifications. Infineon uses a diffusion soldering die attach approach to produce dedicated products in TO263, TO220 and TO262. Four OptiMOS™ T2 products in these packages are ready for production: the IPB160N04S4-02D (with 160A in a TO263 package), the IPB100N04S4-02D (with 100A in TO263) and the IPP/I100N04S4-03D (with 100A in TO220 and TO262). With those products, Infineon exceeds current RoHS (Restriction on Hazardous Substances) directives related to lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives pending implementation after 2014 may require 100% lead-free packaging. The new Infineon devices allow customers to meet these stricter requirements.


Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS™ T2 power MOSFETs offer best-in- class specifications. Infineon uses a diffusion soldering die attach approach to produce dedicated products in TO263, TO220 and TO262. Four OptiMOS™ T2 products in these packages are ready for production: the IPB160N04S4-02D (with 160A in a TO263 package), the IPB100N04S4-02D (with 100A in TO263) and the IPP/I100N04S4-03D (with 100A in TO220 and TO262). With those products, Infineon exceeds current RoHS (Restriction on Hazardous Substances) directives related to lead-based solder used to attach silicon chips to packages. Stricter ELV RoHS directives pending implementation after 2014 may require 100% lead-free packaging. The new Infineon devices allow customers to meet these stricter requirements.