Coil on Module – Packaging innovation for eID documents

Datum: 12.12.2017 | Views: 36 | Länge: 3:11
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Learn about the innovative dual- interface chip packaging technology from Infineon, designed to increase the durability and robustness of smart cards. While at the same time reducing cost for the manufacturer .
7 Buttons Application Kit
Länge: 6:33
Datum: 13.10.2011 | Views: 3717

7 Buttons Application Kit

In this video the 7 buttons kit is presented showing Infineon´s XC822T touch performance. Flexibility is demonstrated through a change of parameters using the whole tool chain – Dave, DaveBench, Fload,U-SPY.
In this video the 7 buttons kit is presented showing Infineon´s XC822T touch performance. Flexibility is demonstrated through a change of parameters using the whole tool chain – Dave, DaveBench, Fload,U-SPY.
You CanPAK™ more performance in your application with Infineon
Länge: 3:48
Datum: 13.10.2011 | Views: 58427

You CanPAK™ more performance in your application with Infineon

Low voltage power MOSFETs, OptiMOS™ 60V to 150V, in high performance double sided cooling package, CanPAK™
Low voltage power MOSFETs, OptiMOS™ 60V to 150V, in high performance double sided cooling package, CanPAK™
New market leading 650V CoolMOS™ technology with integrated fast body diode
Länge: 3:00
Datum: 13.10.2011 | Views: 31473

New market leading 650V CoolMOS™ technology with integrated fast body diode

With the new 650V CoolMOS™ CFD2 Infineon launches its second generation of its market leading high voltage CoolMOS™ MOSFET´s with integrated fast body diode. The new CFD2 devices are the successor of 600V CFD with improved energy efficiency. The softer commutation behavior and therefore better EMI behavior gives this product a clear advantage in comparison with competitor parts.
With the new 650V CoolMOS™ CFD2 Infineon launches its second generation of its market leading high voltage CoolMOS™ MOSFET´s with integrated fast body diode. The new CFD2 devices are the successor of 600V CFD with improved energy efficiency. The softer commutation behavior and therefore better EMI behavior gives this product a clear advantage in comparison with competitor parts.
Infineon EconoPACK™ + D-Series
Länge: 4:58
Datum: 13.10.2011 | Views: 2501

Infineon EconoPACK™ + D-Series

The new device features an improved softness during switch-off and as a result of the soft turn-off a reduced EMI effort.

A lower overshoot voltage as the result of a reduced turn-off current slope, di/dt, in combination with a 50V higher blocking capability, VCES=650V, provides a significant advantage for the application.

The high short circuit capability, tp=10μs, comes as a real surplus for a robust design.
The new device features an improved softness during switch-off and as a result of the soft turn-off a reduced EMI effort.

A lower overshoot voltage as the result of a reduced turn-off current slope, di/dt, in combination with a 50V higher blocking capability, VCES=650V, provides a significant advantage for the application.

The high short circuit capability, tp=10μs, comes as a real surplus for a robust design.